ACM ISS 2022
Sun 20 - Thu 24 November 2022 Wellington, New Zealand
Wed 23 Nov 2022 11:00 - 11:22 at Rutherford House Lecture Theatre 2 - Session 7: XR 2 Chair(s): Barrett Ens

Exploring and interacting with electronics is challenging as the internal processes of components are not visible. Further barriers to engagement with electronics include fear of injury and hardware damage. In response, Augmented Reality (AR) applications address those challenges to make internal processes and the functionality of circuits visible. However, current apps are either limited to abstract low-fidelity applications or entirely virtual environments. We present ElectronicsAR, a tangible high-fidelity AR electronics kit with scaled hardware components representing the shape of real electronics. Our evaluation with 24 participants showed that users were more efficient and more effective at naming components, as well as building and debugging circuits. We discuss our findings in the context of ElectronicsAR's unique characteristics that we contrast with related work. Based on this, we discuss opportunities for future research to design functional mobile AR applications that meet the needs of beginners and experts.

Wed 23 Nov

Displayed time zone: Auckland, Wellington change

11:00 - 12:30
Session 7: XR 2Papers at Rutherford House Lecture Theatre 2
Chair(s): Barrett Ens Monash University
11:00
22m
Talk
ElectronicsAR: Design and Evaluation of a Mobile and Tangible High-Fidelity Augmented Electronics Toolkit
Papers
Sebastian S. Feger LMU Munich, Lars Semmler TU Darmstadt, Albrecht Schmidt LMU Munich, Thomas Kosch Utrecht University
DOI Media Attached
11:22
22m
Talk
Extended Mid-air Ultrasound Haptics for Virtual Reality
Papers
Steeven Villa LMU Munich, Sven Mayer LMU Munich, Jess Hartcher-O'Brien Delft University of Technology, Albrecht Schmidt LMU Munich, Tonja-Katrin Machulla TU Chemnitz
DOI Media Attached
11:45
22m
Talk
Conductor: Intersection-Based Bimanual Pointing in Augmented and Virtual Reality
Papers
Futian Zhang University of Waterloo, Keiko Katsuragawa National Research Council; University of Waterloo, Edward Lank University of Waterloo; Inria; University of Lille
DOI Media Attached
12:07
22m
Talk
AngleCAD: Surface-Based 3D Modelling Techniques on Foldable Touchscreens
Papers
Can Liu City University of Hong Kong, Chenyue Dai City University of Hong Kong; Massachusetts Institude of Technology, Qingzhou, Ma City University of Hong Kong, University of Michigan, Ann Arbor, Brinda Mehra City University of Hong Kong; University of Michigan, Alvaro Cassinelli City University of Hong Kong
DOI Media Attached